Professional SMT Assembly Services for PCB Projects
Professional SMT Assembly Services for PCB Projects
Reliable surface mount PCB assembly from prototype to mass production. Our SMT production lines support high-precision component placement, fine-pitch assembly, and fast turnaround for global electronics manufacturers.
Reliable surface mount PCB assembly from prototype to mass production. Our SMT production lines support high-precision component placement, fine-pitch assembly, and fast turnaround for global electronics manufacturers.
Fast & Reliable SMT PCB Assembly
Fast & Reliable SMT PCB Assembly
We provide professional SMT PCB assembly services for a wide range of electronic products. With advanced pick-and-place machines and automated inspection systems, we ensure precise component placement and stable production quality.
We provide professional SMT PCB assembly services for a wide range of electronic products. With advanced pick-and-place machines and automated inspection systems, we ensure precise component placement and stable production quality.
Our SMT assembly service supports both prototype builds and high-volume production.
Our SMT assembly service supports both prototype builds and high-volume production.
Why Choose Our SMT Assembly Service
Why Choose Our SMT Assembly Service
Experienced SMT manufacturing team
Advanced SMT production lines
Prototype to high-volume support
Competitive pricing
Fast turnaround time
Global customer support
Experienced SMT manufacturing team
Advanced SMT production lines
Prototype to high-volume support
Competitive pricing
Fast turnaround time
Global customer support
Process Flow
Process Flow
Stencil Design & Solder Paste Printing: Laser-cut stencils for ±0.025mm accuracy.
Component Placement: Ultra-precision placement at 25μm CPK.
Reflow Soldering: 7-zone nitrogen reflow ovens with ±1°C thermal control.
AOI & X-ray Inspection: Detects defects like tombstoning, bridging, and voids (<5% PPM).
Stencil Design & Solder Paste Printing: Laser-cut stencils for ±0.025mm accuracy.
Component Placement: Ultra-precision placement at 25μm CPK.
Reflow Soldering: 7-zone nitrogen reflow ovens with ±1°C thermal control.
AOI & X-ray Inspection: Detects defects like tombstoning, bridging, and voids (<5% PPM).
Process Capabilities
Process Capabilities
High-Precision Placement: Advanced equipment handles components from 01005 (0.4mm x 0.2mm) to QFN, BGA, and fine-pitch ICs (0.3mm pitch).
Flexible Production: Supports prototypes, low-volume (<500pcs), and mass production (50,000+ pcs/month).
Material Compatibility: Works with lead-free (RoHS), HASL, ENIG, and OSP surface finishes.
High-Precision Placement: Advanced equipment handles components from 01005 (0.4mm x 0.2mm) to QFN, BGA, and fine-pitch ICs (0.3mm pitch).
Flexible Production: Supports prototypes, low-volume (<500pcs), and mass production (50,000+ pcs/month).
Material Compatibility: Works with lead-free (RoHS), HASL, ENIG, and OSP surface finishes.
3：Prototype to Mass Production
3：Prototype to Mass Production
Flexible manufacturing options for different production stages.
Prototype PCB assembly
Low-volume PCB assembly
Mass production PCBA
Get a PCB Assembly Quote
Get a PCB Assembly Quote
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Our SMT Assembly Capabilities
Our SMT Assembly Capabilities
Support for fine-pitch components including:
BGA
QFN
QFP
0201 / 01005 components
2：Double-Sided SMT Assembly
2：Double-Sided SMT Assembly
Our production lines support double-sided SMT assembly to meet complex PCB design requirements.
Reflow soldering
Automated optical inspection
Stable mass production capability
1：High-Precision Component Placement
1：High-Precision Component Placement
